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SMT HYBRID PACKAGING 2013

4/16/2013 9:48:32 AM

At SMT Hybrid Packaging 2013 in Nuremberg from 16.-18. April 2013 suppliers of the SMT-industry offer products, solutions and services in the field of Electronic Manufacturing.

ENGMATEC GmbH, manufacturer of systems in the field of assembly automation and testing technology will exhibit an Inline Test handler with an integrated MTS30 test system from Digitaltest GmbH at the production line "Future Packaging" of Fraunhofer IZM in Hall 6 Booth 434A.

This year the live production line is addressing e-mobility in rehabilitation technologies. Experience live manufacturing of the production line several times a day first hand. There will be experts of our qualified team at your disposal for a personal conversation at any time.


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