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SMT Hybrid Packaging 2012

5/12/2012 9:48:32 AM

SMT Hybrid Packaging, Europe's leading event on System Integration in Micro Electronics, will take place from 08.-10. May 2012 in Nuremberg.

ENGMATEC GmbH will exhibit an Inline test handler with an integrated MTS30 of Digitaltest GmbH at the production line in hall 6 booth # 434A .

The test system MTS30 is a 19" rack with up to 1024 In-Circuit test channels. Additionally this rack supports extensive functional test modules. In addition to typical analog and digital In-Circuit Test Functional Test and Memory Programming can be applied.

The production line will produce live at the exhibition several times a day.


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